Lu Tsan-Feng | Materials Science | Best Researcher Award

Mr. Lu Tsan-Feng | Materials Science | Best Researcher Award

National Yang Ming Chiao Tung University | Taiwan

AUTHOR PROFILE

Scopus

Orcid ID

Google Scholar

EARLY ACADEMIC PURSUITS

From 2013 to 2017, the individual pursued a Bachelor’s degree in Applied Physics at Tunghai University. During this period, they were actively involved in sports, serving as a member of the school Table Tennis Team and the captain of the department Table Tennis Team.

PROFESSIONAL ENDEAVORS

Teaching Assistant Roles

  • Department of Engineering and System Science, National Tsing Hua University (2017-2019) Served as a Teaching Assistant (TA) for Electrochemistry and Biochemical Analysis courses, responsible for proctoring exams, grading papers, and addressing classroom-related inquiries.
  • Department of Materials Science and Engineering, National Yang Ming Chiao Tung University (2020-2022) Served as a TA for Semiconductor Process and Semiconductor Device & Physics courses, responsible for proctoring exams, grading papers, and assisting students with their questions.

FIB Part-time Staff

Since 2020, working part-time in the TSRI team of photolithography, responsible for preparing TEM samples and measuring cross-sections by FIB. The role requires an understanding of SEM and TEM principles, as well as expertise in sample preparation and analysis for both SEM and TEM.

CONTRIBUTIONS AND RESEARCH FOCUS ON MATERIALS SCIENCE

The individual has focused on various aspects of advanced packaging and third-generation SiC technology:

  • Advanced Packaging:
    • 3DIC: Cu-Cu Bonding Reliability Issues
    • Electroplating: Nanotwinned Cu
    • Stress & Strain Issues in Cu-Cu Bonding
    • Material Analysis
    • FIB & TEM
    • CMP
  • 3rd Generation SiC:
    • Defect Etching
    • Defect Analysis
    • Delayer

IMPACT AND INFLUENCE

Throughout their academic career, the individual has achieved several awards and recognitions, including:

  • Third place in the Yuda Guangya competition (2019) at National Tsing Hua University.
  • Honorable mention in the Poster competition at National Tsing Hua University.
  • Third place in the College Cup competition (2020) at National Yang Ming Chiao Tung University.
  • Lu Shandong scholarship at National Yang Ming Chiao Tung University (2022).
  • Semiconductor Process Engineer Competency Assessment (Information Policy Council) at National Yang Ming Chiao Tung University.

ACADEMIC CITES

The individual has contributed significantly to their fields of study through various competitions and scholarly activities, enhancing their academic reputation and visibility.

LEGACY AND FUTURE CONTRIBUTIONS

As a PhD student at the National Yang Ming Chiao Tung University, the individual continues to push the boundaries of knowledge in Materials Science and Engineering. Their ongoing research and professional engagements are expected to yield impactful contributions to the fields of advanced packaging and semiconductor technologies, potentially leading to innovations that will influence future technological developments.

OTHER IMPORTANT TOPICS

  • Team Leadership: Demonstrated leadership skills as the captain of the department Table Tennis Team and a proactive member of the school Table Tennis Team.
  • Skill Development: Acquired and honed a diverse set of technical skills, including advanced packaging techniques, defect etching and analysis, and proficiency with FIB and TEM, which are crucial for their research and professional activities.

NOTABLE PUBLICATIONS

Enhanced Nanotwinned Copper Bonding through Epoxy-Induced Copper Surface Modification 2023(4)

Effect of Nanotwin Boundary on the Cu-Cu Bonding 2021(12)